Boiling cooling device

The present invention provides an ebullient cooling device which achieves a high critical heat flux and is operable at a high pressure and a low temperature. Provided is an ebullient cooling device that comprises a closed chamber (10) which is provided with, at the bottom thereof, a heating part (11...

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Bibliographic Details
Main Authors OHTA, HARUHIKO, OHTANI, NOBUO, KOBAYASHI, HIROYUKI
Format Patent
LanguageChinese
English
Published 01.03.2014
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
BOILING
BOILING APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
WEAPONS
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Summary:The present invention provides an ebullient cooling device which achieves a high critical heat flux and is operable at a high pressure and a low temperature. Provided is an ebullient cooling device that comprises a closed chamber (10) which is provided with, at the bottom thereof, a heating part (11) to which heat from a heat source (3) is transmitted, and in which a refrigerant is sealed, and that cools the heat source (3) by transmitting the heat from the heating part (11) to the refrigerant. In the closed chamber (10), a first refrigerant and a second refrigerant that is insoluble in the first refrigerant are sealed, and in a state before the heat source (3) generates heat, the first refrigerant (21) in a liquid state, the second refrigerant (22) in a liquid state, and mixed vapor (23) containing the first refrigerant in a gas state and the second refrigerant in a gas state are present in the closed chamber (10).
Bibliography:Application Number: TW20130124307