Circuit board and manufacturing method thereof

A circuit board and manufacturing method thereof are provided. A dielectric layer containing active particles is formed on a dielectric substrate. A surface treatment is performed to the dielectric layer, so as to activate the active particles at the surface of the dielectric layer. A first conducti...

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Bibliographic Details
Main Authors BAI, YOUNG-SHENG, HUANG, SHANG-FENG, LEE, CHANG-MING, YU, CHENG-PO
Format Patent
LanguageChinese
English
Published 16.12.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A circuit board and manufacturing method thereof are provided. A dielectric layer containing active particles is formed on a dielectric substrate. A surface treatment is performed to the dielectric layer, so as to activate the active particles at the surface of the dielectric layer. A first conductive layer is formed on the activated surface of the dielectric layer. A conductive through via is formed in the dielectric layer and the dielectric substrate. A patterned mask layer is formed on the first conductive layer. The patterned mask layer exposes the conductive through via and a portion of the first conductive layer. A second conductive layer is formed on the first conductive layer and the conductive through via exposed by the patterned mask layer. The patterned mask layer and the first conductive layer under the patterned mask layer are removed.
Bibliography:Application Number: TW20120120909