Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the same

An adhesive sheet (10) for manufacturing a semiconductor device is provided, wherein the adhesive sheet is a peelable sheet which is adhered to a lead frame (20) or a circuit board of a semiconductor device, wherein the adhesive sheet includes a substrate and an adhesive layer which includes a fluor...

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Bibliographic Details
Main Authors KASUGA, HIDEMASA, MACHII, SATORU, YAMAI, ATSUFUMI
Format Patent
LanguageChinese
English
Published 16.12.2013
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:An adhesive sheet (10) for manufacturing a semiconductor device is provided, wherein the adhesive sheet is a peelable sheet which is adhered to a lead frame (20) or a circuit board of a semiconductor device, wherein the adhesive sheet includes a substrate and an adhesive layer which includes a fluorine-containing agent and is provided on one surface of the substrate, and the surface fluorine recovery rate of the adhesive layer which is represented by the following formula (I) is 70% or more; surface fluorine recovery (%) = surface fluorine content after recovery / initial surface fluorine content * 100 (I).
Bibliography:Application Number: TW20132110258