Chip engagement device and chip engagement method

• Main Authors: FUKUDA, MASAYUKI, HATA, HANAE, FUKAYA, KOUTA, USHIFUSA, NOBUYUKI, ICHIKAWA, YOSHIO
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a chip engagement device and a chip engagement method which can reduce voids in a solder engagement portion and poor interface engagement. A chip engagement machine which engages a semiconductor chip on a lead frame or a substrate by the solder comprises a conveying unit for conveying the above lead frame or the substrate, a solder supply unit for supplying the solder to the above lead frame or the substrate, and a carrying unit for carrying and engaging the above semiconductor chip onto the above lead frame or the substrate. The chip engagement machine also has a surface clean unit. The surface clean unit removes an oxide film on the solder surface melt in a furnace after the solder is supplied to the lead frame or the substrate. Chip engagement quality can be increased by the above chip engagement device.