Device for spot size measurement at wafer level using a knife edge and a method for manufacturing such a device

The invention relates to a device for spot size measurement at wafer level in a multi charged particle beam lithography system. The device comprises a knife edge structure on top of a scintillating material, such a YAG material. The knife edge structure is arranged in a Si wafer which has a top plan...

Full description

Saved in:
Bibliographic Details
Main Authors SARR, ABDOU, SCHEFFERS, PAUL IJMERT, MEIJER, JAN ANDRIES
Format Patent
LanguageChinese
English
Published 01.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
Online AccessGet full text

Cover

More Information
Summary:The invention relates to a device for spot size measurement at wafer level in a multi charged particle beam lithography system. The device comprises a knife edge structure on top of a scintillating material, such a YAG material. The knife edge structure is arranged in a Si wafer which has a top plane at a sharp angle to a (110) plane of the Si. In an embodiment the angle is in the range from 2 to 4 degrees, preferably in the range from 2.9-3.1 degrees. The invention relates in addition to a method for manufacturing a device for spot size measurement at wafer level in a multi charged particle beam lithography system.
Bibliography:Application Number: TW20121145845