Wiring structure of touch panel and its manufacturing method

The present invention provides: a wiring structure of touch panel, which enables a robust electrical connection formed between a wiring pattern and a connection pattern in a through hole even when the through hole is formed by performing dry etching to an insulation covering layer on the wiring patt...

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Bibliographic Details
Main Authors IWAWAKI, SHINYA, NAKAYAMA, NAOMI, SUGAWARA, HIROYUKI
Format Patent
LanguageChinese
English
Published 01.08.2013
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:The present invention provides: a wiring structure of touch panel, which enables a robust electrical connection formed between a wiring pattern and a connection pattern in a through hole even when the through hole is formed by performing dry etching to an insulation covering layer on the wiring pattern. In the technical means of the present invention, a metal oxide thin film layer is laminated on at least a part of a metal wiring pattern to form a wiring pattern. The metal oxide thin film layer is made to close to the inner bottom surface of the through hole. Therefore, the metal wiring pattern will have no degradation phenomenon due to being oxidized in performing the dry etching step.
Bibliography:Application Number: TW20120129711