Systems and methods for controlling surface profiles of wafers sliced in a wire saw

Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is alte...

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Bibliographic Details
Main Authors SEVERICO, FERDINANDO, VANDAMME, ROLAND R, BHAGAVAT, SUMEET S, ZAVATTARI, CARLO, VERCELLONI, GABRIELE
Format Patent
LanguageChinese
English
Published 16.07.2013
Subjects
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:Systems and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid that comes in contact with the ingot. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
Bibliography:Application Number: TW20121146452