A mold used for chemical treatment

There is provided a mold which is used for chemical treatment, the mold limits sample for a specific treated area. The treatment of electrolysis, electro-deposition, anodization, and etching can be approached on a specific sample area when sample under this mold. The mold structure including: the fi...

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Bibliographic Details
Main Authors YEH, I-JING, CHEN, CHIENON, LIN, JIN-SHYONG, ZHANG, FANG-YING, CHEN, JUN-LIANG
Format Patent
LanguageChinese
English
Published 16.06.2013
Subjects
APPARATUS THEREFOR
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
THEIR RELEVANT APPARATUS
TRANSPORTING
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Summary:There is provided a mold which is used for chemical treatment, the mold limits sample for a specific treated area. The treatment of electrolysis, electro-deposition, anodization, and etching can be approached on a specific sample area when sample under this mold. The mold structure including: the first surface of top cover, snap ring grooves on the first surface of top cover, reaction area on top cover, spacer for sample surface, electrode groove, the second surface of top cover, electrode spacer, the first surface of bottom cover, the second surface of bottom cover, snap ring grooves on bottom cover, snap rings, space groove on the second surface of top cover.
Bibliography:Application Number: TW20110145838