Methods and systems for forming electronic modules

• Main Authors: RADZILOWSKI, LEONARD HENRY, LAUB, MICHAEL FREDRICK, MALSTROM, CHARLES RANDALL, SARRAF, DAVID BRUCE, MORALES, MIGUEL ANGEL
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

A method of manufacturing an electronic module (100) includes providing a conductive strip (152) and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a laminate structure (132) having a conductive layer (136) defined by the conductive strip...