Methods and systems for forming electronic modules

• Main Authors: RADZILOWSKI, LEONARD HENRY, LAUB, MICHAEL FREDRICK, MALSTROM, CHARLES RANDALL, SARRAF, DAVID BRUCE, MORALES, MIGUEL ANGEL
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

A method of manufacturing an electronic module (100) includes providing a conductive strip (152) and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a laminate structure (132) having a conductive layer (136) defined by the conductive strip and a dielectric layer (134) defined by the dielectric material. The method includes applying a carrier strip (158) to the layered structure. The method includes processing the conductive layer to form a circuit (116) while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate (130).