Texture etching solution composition and texture etching method of crystalline silicon wafers

• Main Authors: LIM, DAE-SUNG, LEE, JAE-YUN, HONG, HYUNG-PYO
• Format: Patent
• Language: Chinese; English
• Published: 16.12.2012
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

Disclosed are a texture etching solution composition for a crystalline silicon wafer and a texture etching method using the same. The texture etching solution composition for a crystalline silicon wafer includes an alkaline compound; a polysaccharide; a fatty acid, metal salts thereof, and a mixture thereof; and water as the balance, with an optimum content, so as to maximize the amount of solar light absorption by improving uniformity of the texture within a region on the surface of the crystalline silicon wafer, while reducing light reflectivity, thereby increasing light absorption efficacy.