Texture etching solution composition and texture etching method of crystalline silicon wafers

Disclosed are a texture etching solution composition for a crystalline silicon wafer and a texture etching method using the same. The texture etching solution composition for a crystalline silicon wafer includes an alkaline compound; a polysaccharide; a fatty acid, metal salts thereof, and a mixture...

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Bibliographic Details
Main Authors LIM, DAE-SUNG, LEE, JAE-YUN, HONG, HYUNG-PYO
Format Patent
LanguageChinese
English
Published 16.12.2012
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGYGENERATION, TRANSMISSION OR DISTRIBUTION
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Summary:Disclosed are a texture etching solution composition for a crystalline silicon wafer and a texture etching method using the same. The texture etching solution composition for a crystalline silicon wafer includes an alkaline compound; a polysaccharide; a fatty acid, metal salts thereof, and a mixture thereof; and water as the balance, with an optimum content, so as to maximize the amount of solar light absorption by improving uniformity of the texture within a region on the surface of the crystalline silicon wafer, while reducing light reflectivity, thereby increasing light absorption efficacy.
Bibliography:Application Number: TW20120111369