A system and a method for evaluating non-homogeneous deformations in multilayer wafers

The invention provides a method of evaluating non-homogeneous deformations in a first wafer (110), the first wafer being bonded to a second wafer (120) by molecular bonding. Said method comprises a step of surveying a plurality of measurement points, each of the measurement points being locally repr...

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Bibliographic Details
Main Authors BROEKAART, MARCEL, MARINIER, LAURENT, CASTEX, ARNAUD
Format Patent
LanguageChinese
English
Published 16.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a method of evaluating non-homogeneous deformations in a first wafer (110), the first wafer being bonded to a second wafer (120) by molecular bonding. Said method comprises a step of surveying a plurality of measurement points, each of the measurement points being locally representative of the level of the surface of the first wafer; a step of determining a surface profile of the first wafer passing through a plurality of the measurement points; a step of treating the surface profile of the first wafer for determining a characteristic parameter therefrom; and a step of evaluating a degree of non-homogeneous deformations in the first wafer as a function of the characteristic parameter. The invention also provides a device (147) that can be used to evaluate said non-homogeneous deformations.
Bibliography:Application Number: TW20110106950