Method of semiconductor manufacturing process

A method of semiconductor manufacturing process is provided, which includes steps of: providing a grown substrate, forming a semiconductor substrate on the grown substrate, forming a first groove structure between the semiconductor substrate and the grown substrate, and changing the temperature of t...

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Bibliographic Details
Main Authors WANG, BAU-MING, WU, SERMON YEWUNG, HSIAO, FENGING
Format Patent
LanguageChinese
English
Published 16.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of semiconductor manufacturing process is provided, which includes steps of: providing a grown substrate, forming a semiconductor substrate on the grown substrate, forming a first groove structure between the semiconductor substrate and the grown substrate, and changing the temperature of the grown substrate and the semiconductor substrate.
Bibliography:Application Number: TW20110107823