A sawing wire with abrasive particles electrodeposited onto a substrate wire
The invention relates to a fixed abrasive sawing wire of the type wherein the abrasive particles are held onto the wire by means of an electrolytically deposited binder layer. The substrate wire differs from prior-art substrate wires in that it comprises a plain carbon steel core wire covered with a...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
01.09.2012
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a fixed abrasive sawing wire of the type wherein the abrasive particles are held onto the wire by means of an electrolytically deposited binder layer. The substrate wire differs from prior-art substrate wires in that it comprises a plain carbon steel core wire covered with a metal sheath. The steel core wire ensures that the wire has sufficient strength. The metal sheath is made of a metal with a conductivity that is at least three times, preferably eight times, higher than that of the plain carbon steel. The sheath thickness is at least 2% of the diameter of the sheath covered steel core wire. These conditions ensure that at least half of the electrical current that goes through the substrate wire goes through the sheath i.e. where it is needed in the electrodeposition process. Such a substrate wire reduces the need to have multiple electrical contact points during electrodeposition of the abrasive particles. |
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Bibliography: | Application Number: TW20110137879 |