Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices

A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die packag...

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Bibliographic Details
Main Authors VALPIANI, ANTHONY P, DALE, BARRY T, CHIU, CHIA-PIN, AOKI, RUSSELL S
Format Patent
LanguageChinese
English
Published 16.08.2012
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
Bibliography:Application Number: TW20110149204