Siloxane compositions suitable for forming encapsulants

• Main Authors: THURSTON, SHELLENE K, HARKNESS, BRIAN R, NORRIS, ANN W
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

A composition of the present invention includes an organopolysiloxane component (A) comprising at least one of a disiloxane, a trisiloxane, a tetrasiloxane, a pentasiloxane, and a hexasiloxane, and has at least one of an alkyl group and an aryl group and has an average of at least two alkenyl groups per molecule. Component (A) has a number average molecular weight less than or equal to 1500. The composition further includes an organohydrogensiloxane component (B) having at least one of an alkyl group and an aryl group and having an average of at least two silicon-bonded hydrogen atoms per molecule. Component (B) has a number average molecular weight less than or equal to 1500. The composition yet further includes a catalytic amount of a hydrosilylation catalyst component (C). A product of the present invention is the reaction product of the composition, which may be used to make a light emitting diode.