containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability
Provided is a titanium copper with excellent strength and bendability. A copper alloy is a copper alloy used for electronic parts, which contains: 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing copper and...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
01.05.2012
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a titanium copper with excellent strength and bendability. A copper alloy is a copper alloy used for electronic parts, which contains: 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing copper and unavoidable impurities. The integral intensity of x-ray diffraction from a rolled surface of the copper alloy satisfies the relationship of (1) and (2): (1) 30 ≤ (I/I0{220})/(I/I0{200})9 ≤ 5; (2) 0.36 ≤ 2x(I/I0{111})+(I/I0{311}) ≤ 0.48. |
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Bibliography: | Application Number: TW20110136249 |