Chamber line

• Main Authors: IIO, ITSUSHI, ISSHIKI, MASAHITO
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The purpose of the present invention is to provide a chamber line which can construct the equipment for opening and closing a covering part easily and simply and also benefit from reducing the cost. The chamber line comprises: tracks (11, 12) disposed along the arrangement direction (D) of a plurality of chambers (4A to 4E); and a top-plate converter (13) which can move freely along the tracks (11, 12) and can respectively lift/lower a plurality of top plates (covering parts) (9) disposed at the plurality of chambers (4A to 4E) to thereby open/close the chambers. The top-plate converter (13) can move along the arrangement direction of the plurality of chambers (4A to 4E) freely and can lift/lower the top plates (9) of any of the chambers (4A to 4E). Therefore, it can use one top-plate converter (13) to open and close the plurality of chambers (4A to 4E), construct the equipment for opening and closing the chambers (4A to 4E) easily and simply, and benefit from cost reduction.