Resin composition for adhesive agent, adhesive agent containing thereof, adhesive sheet and printed wire board containing the same as adhesive layer

• Main Authors: NANBARA, SHINTARO, ITO, TAKESHI, ASADA, HIROKO
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2012
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The present invention is a resin composition for adhesive agent, which contains thermoplastic resin (A1), thermoplastic resin (A2), inorganic filling material (B), epoxy resin having dicyclopentadiene backbone (D), wherein the thermoplastic resin (A1) is consisting of polyester resin or polyurethane resin, acid value (unit: eq/106g) is not less than 100 and not more than 1000, glass transition temperature is not lower than 30 DEG C and not higher than 80 DEG C, number average molecular weight is not less than 5.0*103 and not more than 1.0*105, the thermoplastic resin (A2) is consisting of polyester resin or polyurethane resin, glass transition temperature is lower than 0 DEG C, number average molecular weight is not less than 5.0*103 and not more than 1.0*105, as well as in a cured coating film obtained from drying for 3 minutes at 130 DEG C and subsequently performing heat treatment for 4 hours at 140 DEG C, it is the least that at least a part of a thermoplastic resin (A1) and a thermoplastic resin (A2) ado