Thermal plate structure

The present invention relates to a thermal plate structure, which generally comprises two boards that are bonded to each other to form a containing space and a plurality of first capillary layers that is received in the containing space. The first capillary layers are set on the same horizontal plan...

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Bibliographic Details
Main Authors WANG, ZHENG-DU, LIAO, BANG-HONG
Format Patent
LanguageChinese
English
Published 16.12.2011
Subjects
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
WEAPONS
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Summary:The present invention relates to a thermal plate structure, which generally comprises two boards that are bonded to each other to form a containing space and a plurality of first capillary layers that is received in the containing space. The first capillary layers are set on the same horizontal plane and a plurality of channels is formed between the first capillary layers so as to increase vapor diffusion efficiency and promote uniform distribution of a working fluid, thereby increasing the cooling efficiency.
Bibliography:Application Number: TW20100119220