Resin composition for adhesive agent, adhesive agent containing thereof, adhesive sheet and printed wire board containing the same as adhesive layer

The present invention is a resin composition for adhesive agent, which consists of polyurethane resin (a-1), polyester resin (a-2), epoxy resin containing nitrogen atom (b), epoxy resin having dicyclopentadiene backbone (c), wherein the polyurethane resin (a-1) is having carboxyl group, acid value (...

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Bibliographic Details
Main Authors NANBARA, SHINTARO, TANIKAWA, YUTO, ITO, TAKESHI, KENMOTSU, YOICHI, TANAKA, HIDEAKI, ASADA, HIROKO
Format Patent
LanguageChinese
English
Published 01.12.2011
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention is a resin composition for adhesive agent, which consists of polyurethane resin (a-1), polyester resin (a-2), epoxy resin containing nitrogen atom (b), epoxy resin having dicyclopentadiene backbone (c), wherein the polyurethane resin (a-1) is having carboxyl group, acid value (unit: eq/106g) is more than 100 and less than 1000, number average molecular weight is more than 5.0x103 and less than 1.0x105, glass transition temperature is higher than 30 DEG C and lower than 80 DEG C, the polyester resin (a-2) is having a number average molecular weight more than 5.0x103 and less than 1.0x105, glass transition temperature is lower than 0 DEG C; wherein the content by percentage of the aforementioned polyurethane resin (a-1) to the total of the aforementioned polyurethane resin (a-1) and the aforementioned polyester resin (a-2) is more than 70 mass% and less than 95 mass%, the content by percentage of all the epoxy resin contained in the resin composition to the total of the aforementioned poly
Bibliography:Application Number: TW20110112788