Method for sorting LED wafer

A method for sorting LED wafer is to create a characteristic die coordinates by using the unique characteristics dies of the wafer, then using a prober to detect the wafer and establish a die distribution wafer map. During the subsequent sorting process, the characteristic die positions with the add...

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Bibliographic Details
Main Authors OU, SHENG-MING, CAI, ZHEN-YANG, LI, JIAN-DE, CHEN, JIAN-FA
Format Patent
LanguageChinese
English
Published 16.06.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for sorting LED wafer is to create a characteristic die coordinates by using the unique characteristics dies of the wafer, then using a prober to detect the wafer and establish a die distribution wafer map. During the subsequent sorting process, the characteristic die positions with the addition of characteristic die coordinates are compared with the hole positions of the die distribution wafer map to confirm whether or not dies sorting is correct. After the die distribution wafer map is created, then performing an initial scan of the wafer and creating the die coordinates of the wafer for comparing with the characteristic die coordinates. This can improve die sorting processes with satisfactory accuracy and reduce errors.
Bibliography:Application Number: TW20090142141