Lead-free solder alloy with high thermal conductivity

The present invention provides Lead-free solder alloy with high thermal conductivity characterized which is consisted of 0.0001 to 1 wt % of Cu, 0.001 to 0.1 wt % of Ni, 0.0001 to 0.01 wt % of Al, 0.001 to 0.1 wt % of P with the residue being Sn. The present invention relates to a Lead-free solder,...

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Bibliographic Details
Main Author HSU, CHUANG-YAO
Format Patent
LanguageChinese
English
Published 16.04.2011
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:The present invention provides Lead-free solder alloy with high thermal conductivity characterized which is consisted of 0.0001 to 1 wt % of Cu, 0.001 to 0.1 wt % of Ni, 0.0001 to 0.01 wt % of Al, 0.001 to 0.1 wt % of P with the residue being Sn. The present invention relates to a Lead-free solder, which is composed of Sn, Cu, Ni, and Al, having a high stability and prevent oxidization in a high temperature environment by adding P with suitable ratio.
Bibliography:Application Number: TW20090133382