Mold cleaning composition and mold cleaning material, and method for cleaning mold using the same

The present invention relates to a mold cleaning composition for heat molding in which molding is repeatedly performed using a molding material, including: at least one of a synthetic rubber and a synthetic resin which serves as a base material; at least one of an alkali metal salt and an alkali met...

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Bibliographic Details
Main Authors TAKASHIMA, KOUICHI, OKA, JOUJI, FUJIMAKI, KANAME
Format Patent
LanguageChinese
English
Published 01.03.2011
Subjects
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Summary:The present invention relates to a mold cleaning composition for heat molding in which molding is repeatedly performed using a molding material, including: at least one of a synthetic rubber and a synthetic resin which serves as a base material; at least one of an alkali metal salt and an alkali metal hydroxide; and at least one of water and an organic solvent.
Bibliography:Application Number: TW201099123559