Mold cleaning composition and mold cleaning material, and method for cleaning mold using the same
The present invention relates to a mold cleaning composition for heat molding in which molding is repeatedly performed using a molding material, including: at least one of a synthetic rubber and a synthetic resin which serves as a base material; at least one of an alkali metal salt and an alkali met...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.03.2011
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a mold cleaning composition for heat molding in which molding is repeatedly performed using a molding material, including: at least one of a synthetic rubber and a synthetic resin which serves as a base material; at least one of an alkali metal salt and an alkali metal hydroxide; and at least one of water and an organic solvent. |
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Bibliography: | Application Number: TW201099123559 |