Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
Disclosed is a method for producing a semiconductor wafer assembly, which is characterized by comprising: a step wherein a spacer-forming film comprising a supporting base and a spacer-forming layer is prepared; a step wherein the spacer-forming layer of the spacer-forming film is bonded to a semico...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.10.2010
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Subjects | |
Online Access | Get full text |
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