Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device

• Main Authors: YONEYAMA, MASAHIRO, SATO, TOSHIHIRO, DEJIMA, HIROHISA, SHIRAISHI, FUMIHIRO, TAKAHASHI, TOYOSEI, KAWATA, MASAKAZU
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2010
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

Disclosed is a method for producing a semiconductor wafer assembly, which is characterized by comprising: a step wherein a spacer-forming film comprising a supporting base and a spacer-forming layer is prepared; a step wherein the spacer-forming layer of the spacer-forming film is bonded to a semiconductor wafer; a step wherein a mask is arranged on the supporting base side of the spacer-forming film, and the spacer-forming layer is selectively exposed using the mask by means of exposure light transmitted through the supporting base; a step wherein the supporting base is removed; a step wherein a spacer is formed on the semiconductor wafer by developing the spacer-forming layer; and a step wherein a transparent substrate is joined to a surface of the spacer, said surface being on the reverse side of the surface that is bonded with the semiconductor wafer.