Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
Disclosed is a method for producing a semiconductor wafer assembly, which is characterized by comprising: a step wherein a spacer-forming film comprising a supporting base and a spacer-forming layer is prepared; a step wherein the spacer-forming layer of the spacer-forming film is bonded to a semico...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.10.2010
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed is a method for producing a semiconductor wafer assembly, which is characterized by comprising: a step wherein a spacer-forming film comprising a supporting base and a spacer-forming layer is prepared; a step wherein the spacer-forming layer of the spacer-forming film is bonded to a semiconductor wafer; a step wherein a mask is arranged on the supporting base side of the spacer-forming film, and the spacer-forming layer is selectively exposed using the mask by means of exposure light transmitted through the supporting base; a step wherein the supporting base is removed; a step wherein a spacer is formed on the semiconductor wafer by developing the spacer-forming layer; and a step wherein a transparent substrate is joined to a surface of the spacer, said surface being on the reverse side of the surface that is bonded with the semiconductor wafer. |
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Bibliography: | Application Number: TW20100105137 |