Semiconductor wafer assembly, method for producing semiconductor wafer assembly, and semiconductor device
Disclosed is a semiconductor wafer assembly which is characterized by comprising a semiconductor wafer, a transparent substrate that is arranged on the functional surface side of the semiconductor wafer, a spacer that is arranged between the semiconductor wafer and the transparent substrate, and a j...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.10.2010
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed is a semiconductor wafer assembly which is characterized by comprising a semiconductor wafer, a transparent substrate that is arranged on the functional surface side of the semiconductor wafer, a spacer that is arranged between the semiconductor wafer and the transparent substrate, and a joining part that is continuously provided along the outer periphery of the semiconductor wafer and joins the semiconductor wafer and the transparent substrate together. Preferably, the minimum width of the joining part is not less than 50 [mu]m. |
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Bibliography: | Application Number: TW201099105136 |