Semiconductor wafer assembly, method for producing semiconductor wafer assembly, and semiconductor device

Disclosed is a semiconductor wafer assembly which is characterized by comprising a semiconductor wafer, a transparent substrate that is arranged on the functional surface side of the semiconductor wafer, a spacer that is arranged between the semiconductor wafer and the transparent substrate, and a j...

Full description

Saved in:
Bibliographic Details
Main Authors YONEYAMA, MASAHIRO, DEJIMA, HIROHISA, SHIRAISHI, FUMIHIRO, SATO, TOSHIHIRO, TAKAHASHI, TOYOSEI, KAWATA, MASAKAZU
Format Patent
LanguageChinese
English
Published 16.10.2010
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:Disclosed is a semiconductor wafer assembly which is characterized by comprising a semiconductor wafer, a transparent substrate that is arranged on the functional surface side of the semiconductor wafer, a spacer that is arranged between the semiconductor wafer and the transparent substrate, and a joining part that is continuously provided along the outer periphery of the semiconductor wafer and joins the semiconductor wafer and the transparent substrate together. Preferably, the minimum width of the joining part is not less than 50 [mu]m.
Bibliography:Application Number: TW201099105136