Semiconductor wet process and system

A semiconductor wet process and system are provided. The semiconductor wet process includes spinning a semiconductor wafer about an axis normal to a major surface of the wafer. The wafer is translated parallel to the major surface with an oscillatory motion, while spinning the wafer. A material is s...

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Bibliographic Details
Main Authors YANG, CHI-MING, CHEN, CHYI-SHYUAN, HSU, TZU-JENG
Format Patent
LanguageChinese
English
Published 16.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A semiconductor wet process and system are provided. The semiconductor wet process includes spinning a semiconductor wafer about an axis normal to a major surface of the wafer. The wafer is translated parallel to the major surface with an oscillatory motion, while spinning the wafer. A material is sprayed from first and second nozzles or orifices at respective first and second locations on the major surface of the wafer simultaneously while spinning the wafer and translating the wafer.
Bibliography:Application Number: TW20090146326