Semiconductor device

Disclosed is a semiconductor device which comprises either a lead frame having a die pad or a circuit board, one or more semiconductor elements mounted on either the die pad provided on the lead frame or the circuit board, a copper wire that electrically connects an electrically connecting part prov...

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Bibliographic Details
Main Authors ZENBUTSU, SHIN-ICHI, ITOH, SHINGO
Format Patent
LanguageChinese
English
Published 16.08.2010
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Disclosed is a semiconductor device which comprises either a lead frame having a die pad or a circuit board, one or more semiconductor elements mounted on either the die pad provided on the lead frame or the circuit board, a copper wire that electrically connects an electrically connecting part provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and a sealing material that seals the semiconductor element and the copper wire. In the semiconductor device, the combination of the electrode pad and/or the sealing material and the copper wire has predetermined characteristics.
Bibliography:Application Number: TW200998134361