Epoxy resin composition, prepreg, laminate board and multilayer board

• Main Authors: FUJINO, KENTARO, NISHINO, MITSUYOSHI, SATOU, FUMINORI, NAKAMURA, YOSHIHIKO
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2010
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

Disclosed is an epoxy resin composition that is resistant to thermal decomposition temperatures and the like, and that has high adhesive force, particularly high inner layer adhesive force. Also disclosed are a prepreg, a laminate board, and a multilayer board using said composition. The epoxy resin composition contains an epoxy resin which includes nitrogen and bromine in the molecule, a hardening agent having a phenolic hydroxyl group, and a silane composition that has no hardening promotion effect and is reactive with the epoxy resin. The amount of bromine contained in the resin component of the epoxy resin composition is 10 mass% or more.