Thermally conductive gel packs
A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.07.2010
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Subjects | |
Online Access | Get full text |
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Summary: | A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. |
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Bibliography: | Application Number: TW20090132540 |