Plating treatment apparatus

The object of this invention is to provide a plating treatment apparatus, by which at the each bump formed by the electroless plating method, the expected height may be kept and the constant height may be kept and the adhesion between the bumps and the electrode pads may be elevated. The electroless...

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Bibliographic Details
Main Authors AGOH, FUJIO, SHIMOYAMA, AKIO, WATANABE, YUJI, SUZUKI, YOSHIHIDE
Format Patent
LanguageChinese
English
Published 16.06.2010
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:The object of this invention is to provide a plating treatment apparatus, by which at the each bump formed by the electroless plating method, the expected height may be kept and the constant height may be kept and the adhesion between the bumps and the electrode pads may be elevated. The electroless plating method (60) includes: a variable angle fixture (9) that holds a wafer carrier (11) in a tilted position so as to make the circuit forming surface (20) of a semiconductor wafer (1) toward a direction superior to the horizontal direction; a transportation arm (10) that moves up, moves down to transport the wafer carrier (11) held by the variable angle fixture (9), in which the tilt angle ( ) of the wafer carrier (11) imposed by the variable angle fixture (9) is 20 degrees or more and 40 degrees or less.
Bibliography:Application Number: TW20090134141