A method of compression-molding and an apparatus thereof

The overall installation space for a semiconductor chip compression molding device (1) is efficiently reduced, the mold clamping force is effectively reduced for metal molds (5, 6) provided on the device (1), and when substrates (2) (2a, 2b) of different thicknesses are used, the clamping is adjuste...

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Bibliographic Details
Main Authors HIRATA, SHIGERU, TAKAHASHI, MASANOBU, URAGAMI, HIROSHI
Format Patent
LanguageChinese
English
Published 01.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The overall installation space for a semiconductor chip compression molding device (1) is efficiently reduced, the mold clamping force is effectively reduced for metal molds (5, 6) provided on the device (1), and when substrates (2) (2a, 2b) of different thicknesses are used, the clamping is adjusted efficiently according to the thicknesses of the substrates (2). The semiconductor chip compression molding device (1) is configured by stacking two metal molds (5, 6) (both the upper and lower molds) that are used for semiconductor chip compression molding. This device (1) is provided with a mold opening/closing means (12) that closes together the mold faces of the upper molds (5a, 6a), where the mold faces of the lower molds (5b, 6b) of the respective metal molds (5, 6) are arranged vertically. The mold opening/closing means (12) is configured by providing a mold opening/closing mechanism (13) having two racks (15, 16) and one pinion (17), and a thickness adjustment mechanism (14) that makes adjustments accordin
Bibliography:Application Number: TW200998135330