High heat-dissipating LED component and its light-emitting module

• Main Authors: CHEN, BING-HONG, LUO, XIN-MING, HUANG, ZHAO-KUN, YANG, BING-FENG, LIN, YAN-RONG, HUANG, HOU-KUI
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This invention provides a high heat-dissipating LED component, containing a heat-conducting seat and a diode element. The heat-dissipating seat contains a thermal conduction base and a heat-dissipating layer upwardly formed by the thermal conduction base. The heat-dissipating layer is made of a diamond-like carbon film with a thickness of 5000 to 10000. The diode is disposed on the heat-dissipating seat and contains a reflection mirror, an illumination film, a first electrode plate, and a second electrode plate. The reflection mirror is connected to the heat-dissipating layer and electrically conductive and has a bearing part and an electrode part. The illumination film is disposed at the bearing part and can radiate lights when electric power is supplied. The first and second electrode plates are respectively disposed on the top of the illumination film and the electrode part and can cooperate to provide the electric power. In addition, this invention also provides a light-emitting module consisted of the hi