Needle device for pick and place machine

The present invention provides a needle device for pick and place machine used to pick and place the dice attached on a wafer. The needle device includes a cap consisting of a head part and side parts. The needle device has an interior light source disposed in the cavity thereof. A needle is dispose...

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Bibliographic Details
Main Authors TEO, CHEE-YONG, HSU, JIA-BIN, KUO, YUAN-MING, CHEN, CHIEN-FA
Format Patent
LanguageChinese
English
Published 01.12.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a needle device for pick and place machine used to pick and place the dice attached on a wafer. The needle device includes a cap consisting of a head part and side parts. The needle device has an interior light source disposed in the cavity thereof. A needle is disposed in the cavity to support the object die attached on the wafer. The head part of the cap is consisting of a transparent material film so that the light of the interior light source can pass through the head part of the cap to the external environment.
Bibliography:Application Number: TW20080119576