Polyimide precursor composite, polyimide film and transparent flexible film

• Main Authors: ARAKAWA, YUMIKO, KANEYA, YUICHI, SUZUKI, KEIKO
• Format: Patent
• Language: Chinese; English
• Published: 16.11.2009
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

A polyimide precursor, a polyimide film obtained from the polyimide precursor, and a transparent flexible film are provided, wherein the polyimide precursor can form a polyimide film having excellent high transparency, low thermal expansion, low birefringence and high heat-endurance. The polyimide precursor composite in this invention is characterized in having a polyimide precursor, which has a structure formed by the reaction of Diamin (A) and a dianhydride component (B), wherein the Diamin (A) contains fluorine-containing aromatic Diamin (a1) and trans-1, 4-cyclohexyl-Diamin (a2), represented by the following chemical formula (I), and the dianhydride component (B) contains alphatic tetra-carbon dianhydride (b1) and aromatic tetra-carbon dianhydride (b2). In formula (I), R1 and R2 are independently selected from -H, -(CF2)n-CF3, -O (CF2)n-CF3 (n is larger than 0 and smaller than or equal to 7), and at least one of R1 and R2 is a radical containing fluorine element.