Production method of multilayer printed wiring board and multilayer printed wiring board

• Main Authors: NAKAMURA, JUNICHI, NAKAMURA, SHIGEO, OHASHI, SEIICHIRO, HAYASHI, EIICHI, YAZAWA, TAKAAKI
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2009
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The production method of the multilayer printed wiring board of the present invention includes forming a via hole by laser irradiation in insulating layer formed by a prepreg comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching...