Production method of multilayer printed wiring board and multilayer printed wiring board

The production method of the multilayer printed wiring board of the present invention includes forming a via hole by laser irradiation in insulating layer formed by a prepreg comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching...

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Bibliographic Details
Main Authors NAKAMURA, JUNICHI, NAKAMURA, SHIGEO, OHASHI, SEIICHIRO, HAYASHI, EIICHI, YAZAWA, TAKAAKI
Format Patent
LanguageChinese
English
Published 01.10.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The production method of the multilayer printed wiring board of the present invention includes forming a via hole by laser irradiation in insulating layer formed by a prepreg comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. Due to such constitution, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 m or below.
Bibliography:Application Number: TW200897145199