Dimethylformamide-free formulations using dicyandiamide as curing agent for thermosetting epoxy resins

Substantially homogeneous solutions including dicyandiamide and phenolic hardeners having the general formula: where R' and R" may be the same or different and each represents R- or RO-radicals, with R being an alkyl or aromatic radical; R"' is hydrogen, an alkyl or aromatic radi...

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Bibliographic Details
Main Author GAN, JOSEPH
Format Patent
LanguageChinese
English
Published 16.07.2009
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:Substantially homogeneous solutions including dicyandiamide and phenolic hardeners having the general formula: where R' and R" may be the same or different and each represents R- or RO-radicals, with R being an alkyl or aromatic radical; R"' is hydrogen, an alkyl or aromatic radical, -CH2P(O)R'R", or -CH2OR; n is a whole number within the range from 0 to 100. Also disclosed are curable compositions including an epoxy resin and the above-described phenolic hardener solution and processes for making the same.
Bibliography:Application Number: TW200897145682