Method for forming copper wire pattern and copper oxide particle dispersion for the method

A method for forming low electric resistance copper wire pattern and a copper oxide particle dispersion for the method are provided. The method can prevent the occurrence of cracks, and use copper particle which has lower electron migration and lower cost for itself without using surface treatment a...

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Main Authors YAMAMOTO, KAZUNORI, MACHII, YOUICHI, YOKOZAWA, SHUNYA, MASUDA, KATSUYUKI, KUMASHIRO, YASUSHI, NAKAKO, HIDEO, EJIRI, YOSHINORI
Format Patent
LanguageChinese
English
Published 01.07.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CASTING
CHEMISTRY
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INORGANIC CHEMISTRY
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
PRINTED CIRCUITS
TRANSPORTING
WORKING METALLIC POWDER
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Summary:A method for forming low electric resistance copper wire pattern and a copper oxide particle dispersion for the method are provided. The method can prevent the occurrence of cracks, and use copper particle which has lower electron migration and lower cost for itself without using surface treatment agent which is needed for oxidation resistance and dispersion of copper particle. The method for forming low electric resistance copper wire pattern copper includes: a step for forming random pattern on substrate by using an dispersion in which copper particles with a surface of copper oxide is dispersed, and a step for reducing the copper oxide on the surface of copper particles to copper by using atom hydrogen, and sintering the reduced and formed copper particles with each other.
Bibliography:Application Number: TW200897140335