Method for manufacturing an integrated circuit and semiconductor structures of the integrated circuit

• Main Authors: LIN, CHIEN-MING, CHENG, RUI-HUANG, YU, CHI-LU, HUANG, RUEI-HAO
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2009
• Subjects: ADVERTISING; ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; EDUCATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PHYSICS; SEALS; SEMICONDUCTOR DEVICES

The present invention discloses a method for manufacturing an integrated circuit. The method includes: performing ion implantation on a wafer to make a chip in the wafer have an original doping concentration; dividing the chip into a plurality of regions; and controlling at least one region of plurality of the regions not to have further ion implantation performed thereon, thereby making the region only have single ion implantation performed thereon to utilize the original doping concentration as a doping concentration of N-wells or P-wells of transistors in the region. Additionally, the region corresponds to signal output circuits of the integrated circuit.