Manufacturing method of a probe card
A manufacturing method of a probe card is disclosed, which comprises the following steps: (A) mounting a plurality of probes with a fixing base; (B) performing an alignment process, such as grinding or etching, to a test section of each of the probes, such that an end section of each test section is...
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| Main Author | |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.07.2009
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| Subjects | |
| Online Access | Get full text |
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| Summary: | A manufacturing method of a probe card is disclosed, which comprises the following steps: (A) mounting a plurality of probes with a fixing base; (B) performing an alignment process, such as grinding or etching, to a test section of each of the probes, such that an end section of each test section is located at the same height; (C) applying a layer of conductive protection coating to the test section of each probe; and (D) assembling a circuit board with the fixing base, and connecting the circuit board with one connection section of the probe. The step of applying the conductive protection coating to the probe is performed after the step of mounting the probes with the fixing base and the step of performing the probe alignment process; and before the step of assembling the circuit board with the fixing base and the probe. Therefore, the present invention achieves the advantages of a simple and convenient manufacturing process and an easy operation. Further, the present invention does not need a large-sized co |
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| Bibliography: | Application Number: TW20070149215 |