Solder mold with venting channels, method for forming a solder mold with venting channels and method for using the same

A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities. A method for forming a solder mold for transferring solder to a wafer includes etching a...

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Bibliographic Details
Main Authors BUDD, RUSSELL ALAN, BEZAMA, RASCHID JOSE, COLGAN, EVAN GEORGE, GRUBER, PETER ALFRED, OBERSON, VALERIE
Format Patent
LanguageChinese
English
Published 16.06.2009
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities. A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.
Bibliography:Application Number: TW20080129507