Liquid epoxy resin forming formulation containing inorganic particles

• Main Authors: SUEMURA, NAOHIKO, TAKEYAMA, TOSHIAKI
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2009
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Disclosed is a liquid preparation for forming an epoxy resin, which enables to obtain a cured product having both high transparency and high bending strength, while maintaining good handleability in a liquid state. Specifically disclosed is a liquid preparation for forming an epoxy resin, which contains an agent A and an agent B. The agent A contains a modified epoxy resin (I) obtained from at least one compound (i) having at least one functional group represented by the formula (1) below in a molecule and a compound (ii) having a glycidyl group in a molecule, and an inorganic particle (II), and the agent (B) contains a curing agent (III). formula (1) (In the formula, R1 and R2 each represents an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of them.) Also specifically disclosed is a liquid preparation for forming an epoxy resin, which contains an agent A' and an agent B'. The agent A' contains th