Low-cost electrostatic clamp with fast declamp time

A method for manufacturing a semiconductor wafer electrostatic clamp, comprising providing a mounting plate, forming an insulative layer on an insulating portion of the mounting plate, forming a first electrode on a first portion of the mounting plate, forming a second electrode on a second portion...

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Bibliographic Details
Main Authors PHARAND, MICHEL, RUBIN, LEONARD MICHAEL, LAFONTAINE, MARVIN RAYMOND, BECKER, KLAUS
Format Patent
LanguageChinese
English
Published 01.03.2009
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:A method for manufacturing a semiconductor wafer electrostatic clamp, comprising providing a mounting plate, forming an insulative layer on an insulating portion of the mounting plate, forming a first electrode on a first portion of the mounting plate, forming a second electrode on a second portion of the mounting plate, forming a first segment having a first conductivity over the first electrode, forming a first region having a second conductivity over the first segment that creates an n-type composite, forming a second segment having a third conductivity formed over the second electrode, forming a second region having a fourth conductivity formed over the second region that creates a p-n type composite.
Bibliography:Application Number: TW200796139815