Method for controlling process gas concentration

The invention relates to a method for controlling the process gas concentration for the treatment of substrates in a process chamber, wherein a liquid is evaporated in a bubbler by means of the bubbles of a carrier gas that are guided through. The aim of the invention is to create a method for contr...

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Bibliographic Details
Main Authors VOELLER, HANS ULRICH, HARTUNG, ROBERT MICHAEL, MUELLER, ROLF
Format Patent
LanguageChinese
English
Published 16.01.2009
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEPARATION
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:The invention relates to a method for controlling the process gas concentration for the treatment of substrates in a process chamber, wherein a liquid is evaporated in a bubbler by means of the bubbles of a carrier gas that are guided through. The aim of the invention is to create a method for controlling the process gas concentration that is easy to implement. Said aim is achieved by the production of a predetermined constant interior pressure within the bubbler, and subsequent introduction of a carrier gas into the bubbler while at the same time controlling the temperature of the medium to be evaporated within the bubbler in order to set a predetermined vapor pressure.
Bibliography:Application Number: TW200897117912