Electronic device with passive heat-dissipating mechanism

An electronic device with passive heat-dissipating mechanism is disclosed. The electronic device includes a printed circuit board assembly and a radiation-enhancing layer. The printed circuit board assembly has plural electronic elements. At least portion of the surfaces of the electronic elements d...

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Bibliographic Details
Main Authors YEH, WEN-YI, CHIEN, SHIH-KAI, LIN, KENG, HSU, JUI-YUAN, CHEN, YIN-YUAN
Format Patent
LanguageChinese
English
Published 16.12.2008
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An electronic device with passive heat-dissipating mechanism is disclosed. The electronic device includes a printed circuit board assembly and a radiation-enhancing layer. The printed circuit board assembly has plural electronic elements. At least portion of the surfaces of the electronic elements disposed on the printed circuit board are attached with the radiation-enhancing layer so as to dissipate the heat generated from the electronic elements auxiliary. The radiation-enhancing layer at least contains insulating ceramics material.
Bibliography:Application Number: TW20070120398