Method of testing packaged device and piercing probe structure thereof

The test method of packaged devices disclosed by this invention utilizes a plurality of sharp enough and hard probes to pierce the surface insulation layer of a printed circuit board and therefore the probes touch the connecting wires, which are electrically connected to the installed packaged devic...

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Bibliographic Details
Main Authors ZHANG, ZONG-GUI, CENG, SHEI-WO
Format Patent
LanguageChinese
English
Published 01.11.2008
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:The test method of packaged devices disclosed by this invention utilizes a plurality of sharp enough and hard probes to pierce the surface insulation layer of a printed circuit board and therefore the probes touch the connecting wires, which are electrically connected to the installed packaged device. By using the probes to transmit test signals to the connecting wires, the packaged device can be indirectly tested through the connecting wires of the printed circuit board without damaging the packaged device. The piercing probe structure of this invention mainly comprises a hollow cylindrical probe sleeve, a plurality of probe terminals protruding inside the probe sleeve, and wires electrically connected to the probe terminals.
Bibliography:Application Number: TW20070114106