Probing tester and testing method for a wafer using the same

Disclosed herein are a probing tester and a testing method for a wafer using the same. The probing tester includes a chuck, a plurality of supporting pins, and a vacuum device. The chuck is configured such that a wafer is seated thereon, and is provided with a plurality of through-holes, which pass...

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Bibliographic Details
Main Authors CHOI, KI-UK, CHOI, SU-HYUN, JIN, JEON-HO, KIM, MEANG-KWON
Format Patent
LanguageChinese
English
Published 16.08.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:Disclosed herein are a probing tester and a testing method for a wafer using the same. The probing tester includes a chuck, a plurality of supporting pins, and a vacuum device. The chuck is configured such that a wafer is seated thereon, and is provided with a plurality of through-holes, which pass through the chuck vertically with respect to the upper surface thereof. The supporting pins are located under the chuck, are provided with vacuum holes, which formed from upper to lower ends thereof, and are provided at locations respectively corresponding to the plurality of through-holes. The vacuum device is configured to form a vacuum state inside the plurality of vacuum holes such that the wafer is drawn to and held on the upper ends of the plurality of supporting pins.
Bibliography:Application Number: TW20070147895